Job Description
Fairwork is seeking a qualified candidate to enhance the Wire Bond Process in Ipoh, Malaysia. Responsibilities include improving assembly yield, analyzing data for manufacturing reports, and supporting engineering initiatives. The role requires a Bachelor’s degree in electronics or electrical engineering, along with experience in high-volume manufacturing.
Preferred candidates will have strong analytical skills and experience in process problem solving. Leadership experience is also an advantage.
#J-18808-LjbffrReady to Apply?
Submit your application today and join our talented team at Fairwork.
Submit ApplicationJob Details
- Location ipoh, perak
- Job Type Full-time
- Category Engineering
- Posted Date June 05, 2026
- Application Deadline July 15, 2026