Wire Bond Process Development Engineer – Packaging R&D

Nexperia
📍 seremban, negeri sembilan, Malaysia 💼 Full-time 🕒 Posted June 07, 2026

Job Description

Nexperia is seeking a Process Development Engineer to develop and optimize semiconductor assembly processes, ensuring manufacturability and reliability for new products.

This role involves driving process development from concept to stable manufacturing, with responsibilities including technical discussions and applying statistical tools for data-based decisions. The ideal candidate will have a bachelor's degree in engineering and experience in semiconductor environments, along with strong communication and analytical skills.

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Job Details

  • Location seremban, negeri sembilan
  • Job Type Full-time
  • Category Engineering
  • Posted Date June 07, 2026
  • Application Deadline July 17, 2026