Job Description
Job Description:
Provide leadership and insights into root cause of device failures via in-depth failure analysis using intricate tools and state of the art equipment. Collaborate with product engineering and R&D team to translate findings into solutions for new design improvements. Monitor and use big data analysis on long term wafer reliability performance and propose improvements to product design or manufacturing process changes.
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Provide leadership and insights into root cause of device failures via in-depth failure analysis using intricate tools and state of the art equipment. Collaborate with product engineering and R&D team to translate findings into solutions for new design improvements. Monitor and use big data analysis on long term wafer reliability performance and propose improvements to product design or manufacturing process changes.
R
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Submit ApplicationJob Details
- Location sembawang, north region
- Job Type Full-time
- Category Other-General
- Posted Date June 14, 2026
- Application Deadline July 24, 2026