Job Description
Job Description1) Establish system-level thermal models and design competitive cooling solutions.
2) Participate in the development, analysis, and evaluation of SOC TDP (Thermal Design Power).
3) Design, set up, execute, and deliver results of various thermal and TDP experiments to verify SOC and system hardware performance.
4) Support technical projects and collaborate with other internal organizations and customers to support the execution process throughout the development cycle.
5) Perform thermal simulations and verifications, and present and communicate the results to partners.Requirement1) Proficient in using thermal simulation analysis software such as Icepak and Flotherm for CFD simulations.
2) Possesses practical experience in operating temperature and power consumption measurement instruments and equipment for thermal and power consumption verification.
3) Able to design and execute thermal/power consumption test experime...
2) Participate in the development, analysis, and evaluation of SOC TDP (Thermal Design Power).
3) Design, set up, execute, and deliver results of various thermal and TDP experiments to verify SOC and system hardware performance.
4) Support technical projects and collaborate with other internal organizations and customers to support the execution process throughout the development cycle.
5) Perform thermal simulations and verifications, and present and communicate the results to partners.Requirement1) Proficient in using thermal simulation analysis software such as Icepak and Flotherm for CFD simulations.
2) Possesses practical experience in operating temperature and power consumption measurement instruments and equipment for thermal and power consumption verification.
3) Able to design and execute thermal/power consumption test experime...
Ready to Apply?
Submit your application today and join our talented team at MediaTek.
Submit ApplicationJob Details
- Location Zhubei City, Hsinchu County
- Job Type Full-time
- Category Engineers
- Posted Date February 28, 2026
- Application Deadline April 09, 2026