Job Description
Job Description1. Develop 3.5D methodology from RTL to GDS and Package
2. Coordinate Thermal and PI/SI team to deal with high power design
3. Execute the project at different phasesRequirement1. Advance process or package design experience
2. Better to have 3.5D design experience
3. Better to have experiene in large scale and high power design
4. Good communication skill in English
2. Coordinate Thermal and PI/SI team to deal with high power design
3. Execute the project at different phasesRequirement1. Advance process or package design experience
2. Better to have 3.5D design experience
3. Better to have experiene in large scale and high power design
4. Good communication skill in English
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Submit your application today and join our talented team at MediaTek.
Submit ApplicationJob Details
- Location Hsinchu City, Taiwan Province
- Job Type Full-time
- Category Engineers
- Posted Date February 27, 2026
- Application Deadline April 08, 2026