Job Description
**Discover a more connected career**
At TelCom Construction, the Technician Field Make Ready Inspector is responsible for performing site assessments, quality control inspections, and documentation of Outside Plant (OSP) telecommunications infrastructure to ensure compliance with engineering specifications, safety standards, and client requirements. This role is critical in the pre-construction (Make Ready) phase, preparing sites for the next phase of work, as well as final quality checks on completed projects. Essential Job Duties and Responsibilities
**Connecting you to great benefits**
+ Weekly Paychecks
+ Paid Time Off, Parental Leave, and Holidays
+ Insurance (including medical, prescription drug, dental, vision, disability, life insurance)
+ 401(k) w/ Company Match
+ Stock Purchase Plan
+ Education Reimbursement
+ Legal Insurance
+ Discounts on gym memberships, pet insurance, and much more!
**What you’ll do**
+ *...
At TelCom Construction, the Technician Field Make Ready Inspector is responsible for performing site assessments, quality control inspections, and documentation of Outside Plant (OSP) telecommunications infrastructure to ensure compliance with engineering specifications, safety standards, and client requirements. This role is critical in the pre-construction (Make Ready) phase, preparing sites for the next phase of work, as well as final quality checks on completed projects. Essential Job Duties and Responsibilities
**Connecting you to great benefits**
+ Weekly Paychecks
+ Paid Time Off, Parental Leave, and Holidays
+ Insurance (including medical, prescription drug, dental, vision, disability, life insurance)
+ 401(k) w/ Company Match
+ Stock Purchase Plan
+ Education Reimbursement
+ Legal Insurance
+ Discounts on gym memberships, pet insurance, and much more!
**What you’ll do**
+ *...
Ready to Apply?
Submit your application today and join our talented team at TelCom Construction.
Submit ApplicationJob Details
- Location Des Moines, IA
- Job Type Full-time
- Category other-general
- Posted Date June 06, 2026
- Application Deadline June 11, 2026