Job Description
About the role
We are seeking a Senior Die Bond Equipment & Process Engineer to join our semiconductor manufacturing team. In this role, you will take ownership of die bond equipment, including buyoff machines, and processes to ensure high-quality, reliable, and efficient production. You will collaborate with R&D, manufacturing, and process teams to support new product introductions, troubleshoot equipment issues, and drive continuous process improvements.
What You Will Do:
Lead the setup, qualification, and optimization of die bond equipment, including buyoff machines.
Develop, implement, and improve die attach processes for semiconductor devices.
Troubleshoot equipment and process issues to maintain high yield and reliability.
Collaborate with cross-functional teams to support new product introductions.
Analyze process and equipment data to identify trends and implement co...
Ready to Apply?
Submit your application today and join our talented team at Nexperia.
Submit ApplicationJob Details
- Location Seremban, Negeri Sembilan
- Job Type Full-time
- Category Engineers
- Posted Date February 21, 2026
- Application Deadline April 02, 2026