Staff Engineer, Packaging FA (Semiconductor Devices)

Sandisk
📍 batu kawan, penang, Malaysia 💼 Full-time 🕒 Posted June 22, 2026

Job Description

Sandisk in Batu Kawan, Malaysia is seeking an experienced Device Physical Failure Analysis (PFA) Engineer to support advanced semiconductor chip development. The role emphasizes mandatory hands-on SEM and FIB expertise to influence package and product design.

The ideal candidate should possess a Bachelor's degree in a relevant field and over three years of direct experience in physical failure analysis with semiconductor devices. Excellent communication skills and teamwork capabilities are essential.

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Job Details

  • Location batu kawan, penang
  • Job Type Full-time
  • Category Engineering
  • Posted Date June 22, 2026
  • Application Deadline August 01, 2026