Job Description
Job Description
Renesas is seeking a package expert for its AI High Density Power Modules product families. These products push the technology limits of speed, density, and efficiency and deliver power to the highest performance computing and connectivity functions. Typical applications include Artificial Intelligence, High Performance Networking, and other High Performance Computing applications. This role sits within our Performance Computing Power business, which is one of the fastest-growing and exciting product lines at Renesas, with a multi-market scope and a large product development team.
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- Location Taiwan, Taichung City
- Job Type Full-time
- Category Engineers
- Posted Date June 05, 2026
- Application Deadline July 15, 2026