Sr Mgr, Bump/DPS & Assembly Engineering

Qorvo

📍 Singapore, Singapore, Singapore 💼 Regular 🕒 Posted June 26, 2026

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Job Description

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit to learn how our innovative team is helping connect, protect and power our planet.
RESPONSIBILITIES / ACCOUNTABILITIES:
Early engagement & execution of a Packaging Technology development working with OSAT partner on-site aligned with cooperate roadmap to meet future Qorvo Business Unit needs

Could Manage multiple projects for package development from risk assessment, process /BOM establishment, qualification.

Lead and Manage OSAT New Technology and New P...
            

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Job Details

Location Singapore, Singapore
Job Type Regular
Category Engineers
Posted Date June 26, 2026
Application Deadline August 05, 2026