Job Description
Sandisk in Malaysia's Penang region seeks a SiP packaging integration engineer within the packaging engineering group. You will lead new SiP product development from concept through mass production, translating innovative concepts into market-ready solutions while collaborating with global teams.
The role requires a Master’s or equivalent in materials/engineering, strong problem-solving and communication skills, and a track record in semiconductor packaging.
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Submit ApplicationJob Details
- Location batu kawan, penang
- Job Type Full-time
- Category Engineering
- Posted Date July 27, 2026
- Application Deadline September 05, 2026