Silicon Packaging Design Engineer

Intel
📍 Phoenix, AZ, United States 💼 Full-time 🕒 Posted June 08, 2026

Job Description

**Job Details:**

**Job Description:**

Intel seeks a motivated and innovative Silicon Packaging Design Engineer to join our team, driving the end-to-end development of silicon interposer and bridge designs that define the future of computing and connectivity. As a key contributor to Intel's cutting-edge technology, you will play a pivotal role in bridging silicon and hardware design, optimizing package performance, and delivering high-impact solutions that meet performance, cost, and manufacturability goals. Your expertise will directly contribute to Intel's mission to create world-changing technology that improves lives and connects communities worldwide.

**Key Responsibilities:**

- Design and implement physical layout and routing of silicon interposers and embedded bridges.
- Perform substrate fit and routing studies to evaluate design tradeoffs in performance, cost, and manufacturability.
- Collaborate closely with silicon, technology develop...

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Job Details

  • Location Phoenix, AZ
  • Job Type Full-time
  • Category other-general
  • Posted Date June 08, 2026
  • Application Deadline June 13, 2026