SiC Wafer & Package Technology Development Engineer

onsemi
📍 Munich, Germany, Germany 💼 Full-time 🕒 Posted June 03, 2026

Job Description

Technical and customer support for the qualification of SiC die sales and development. The candidate must have knowledge of package design, assembly processes and interactions with device.

**onsemi** (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

**More details about our company benefits can be found here:**

https://www.onsemi.com/careers/career-benefits

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Job Details

  • Location Munich, Germany
  • Job Type Full-time
  • Category other-general
  • Posted Date June 03, 2026
  • Application Deadline June 08, 2026