Job Description
Nexperia is a world‑class company in semiconductor development and in‑house production. A proven global player with an entrepreneurial mentality. At our core is an 13,000+ strong international network with a singular focus. Built on passion and commitment to our work, belief in our goals and a drive to succeed regardless of the challenges we face. We support, reward and challenge individuals equally, in a dynamic and energetic environment.
About The Role
We are seeking a Senior Wire Bond Equipment & Process Engineer to join our dynamic team. In this role, you will leverage your expertise in wire bonding technology to optimize semiconductor manufacturing processes and ensure the highest quality and reliability in production. You will work closely with cross‑functional teams, including R&D, process engineering, and manufacturing, to drive continuous improvement and innovation.
What You Will Do
- Lead the setup, qualification, and optimizat...
Ready to Apply?
Submit your application today and join our talented team at Nexperia.
Submit ApplicationJob Details
- Location seremban, negeri sembilan
- Job Type Full-time
- Category Engineering
- Posted Date June 20, 2026
- Application Deadline July 30, 2026