Job Description
Job Description
A leading provider of high-performance analog and mixed-signal semiconductor solutions is looking for a Senior or Principal IC Design Engineer to join their advanced connectivity team. This group develops cutting-edge signal conditioning ICs that enable next-generation high-speed copper interconnects for data center, telecom, and networking applications.
The ideal candidate will have deep expertise in BiCMOS and a proven track record designing adaptive equalizers and re-drivers for high-speed copper cable and board-level applications. This is a hands-on technical role requiring strong circuit-level design experience and full IC tapeout ownership.
Key Responsibilities:
Design and tapeout BiCMOS ICs for adaptive equalizers and re-drivers in high-speed copper interconnects
Develop broadband high-frequency circuits meeting stringent signal integrity and jitter performance targets
Own block-level schematic design and verificati...
A leading provider of high-performance analog and mixed-signal semiconductor solutions is looking for a Senior or Principal IC Design Engineer to join their advanced connectivity team. This group develops cutting-edge signal conditioning ICs that enable next-generation high-speed copper interconnects for data center, telecom, and networking applications.
The ideal candidate will have deep expertise in BiCMOS and a proven track record designing adaptive equalizers and re-drivers for high-speed copper cable and board-level applications. This is a hands-on technical role requiring strong circuit-level design experience and full IC tapeout ownership.
Key Responsibilities:
Design and tapeout BiCMOS ICs for adaptive equalizers and re-drivers in high-speed copper interconnects
Develop broadband high-frequency circuits meeting stringent signal integrity and jitter performance targets
Own block-level schematic design and verificati...
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Submit ApplicationJob Details
- Location Milpitas, CA
- Job Type Full-time
- Category other-general
- Posted Date June 04, 2026
- Application Deadline June 15, 2026