Job Description
A leading electronics manufacturing company in Ipoh, Malaysia, is looking for an experienced professional to enhance the Wire Bond Process, ensuring high yield and process optimization. The ideal candidate has a Bachelor's degree in Electronics or Electrical Engineering and experience in high-volume manufacturing. Responsibilities include data analysis, process improvements, and team leadership. Knowledge of relevant software like SAS JMP and Minitab is preferred, along with excellent analytical skills.
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Submit ApplicationJob Details
- Location Ipoh, Perak
- Job Type Full-time
- Category Engineering
- Posted Date March 03, 2026
- Application Deadline April 12, 2026