Job Description
We are seeking a Senior Wire Bond Equipment & Process Engineer to join our dynamic team. In this role, you will leverage your expertise in wire bonding technology to optimize semiconductor manufacturing processes and ensure the highest quality and reliability in production. You will work closely with cross-functional teams, including R&D, process engineering, and manufacturing, to drive continuous improvement and innovation.
What You Will Do:
Lead the setup, qualification, and optimization/CZ/DOE of wire bonding equipment and processes.
Develop and implement process improvements to enhance yield, reliability, and throughput.
Troubleshoot, Disposition and resolve equipment and process issues in a fast-paced production environment.
Collaborate with design, quality, and manufacturing teams to support new product introductions.
Analyze process data to identify trends and implement corrective ...
Ready to Apply?
Submit your application today and join our talented team at Nexperia.
Submit ApplicationJob Details
- Location Seremban, Negeri Sembilan
- Job Type Full-time
- Category Engineers
- Posted Date June 08, 2026
- Application Deadline July 18, 2026