Senior Wire Bond & Die Attach Process Engineer (Onsite)

II-VI UK, Ltd.

📍 ipoh, perak, Malaysia 💼 Full-time 🕒 Posted June 09, 2026

Apply Now Similar Jobs

Job Description

II-VI UK, Ltd. is seeking a qualified professional in Ipoh, Malaysia to improve and sustain the Die Attach & Wire Bond Process. The candidate will collect data to generate engineering reports and ensure the assembly yield meets KPI targets. 
Successful candidates should possess a Bachelor's degree in Engineering, ideally in Electronics. Experience in high volume manufacturing and strong analytical skills are essential for this full-time onsite role. 
 #J-18808-Ljbffr
            

Ready to Apply?

Submit your application today and join our talented team at II-VI UK, Ltd..

Submit Application

Job Details

Location ipoh, perak
Job Type Full-time
Category Engineering
Posted Date June 09, 2026
Application Deadline July 19, 2026