Job Description
Are you ready to drive cutting-edge wafer bonding technologies? Join our wafer-level packaging team and help pioneer innovative processes for bonding and debonding wafers, enabling the development of next-generation 3D and heterogeneous integration technologies.
Your future tasks include:
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Submit your application today and join our talented team at Academic Positions.
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- Location Stockholm, Stockholm County
- Job Type permanent
- Category Life Scientists
- Posted Date July 08, 2026
- Application Deadline August 17, 2026