Job Description
We are developing an innovative solution that will bring full automation to the process of analyzing silicon wafers using advanced microscopy techniques. The project aims to replace manual operations with a seamless, automated workflow that ensures consistent and precise results.Our work covers both the creation of a modern user interface for operators and the integration of different stages of the process into one coherent system. The teams involved collaborate across multiple locations, working together on cutting-edge technology that will push the boundaries of materials research and industrial applications.This project is a unique opportunity to contribute to a highly specialized field, combining automation, software engineering, and advanced scientific instrumentation to deliver a next-generation solution for the semiconductor industry.
Technical responsibilities:
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Job Details
- Location Wrocław, Lower Silesian Voivodeship
- Job Type Full-time
- Category Computer Occupations
- Posted Date March 02, 2026
- Application Deadline April 11, 2026