Job Description
About the Role
We are seeking a highly driven and technically strong Plating Process Engineer to lead sustaining and continuous enhancement initiatives across semiconductor packaging operations. This role plays a critical part in ensuring plating process stability, yield improvement, and high equipment performance to support advanced and high-volume manufacturing (HVM).
You will work closely with cross-functional teams including Equipment Engineering, R&D, NPI, Product Design, and Reliability to ensure plating capabilities meet evolving package architecture and technology requirements.
What You Will Do
Lead and manage sustaining activities and continuous improvement of plating processes across multiple semiconductor package platforms.
Conduct routine process capability and performance evaluations to ensure alignment with manufacturing standards.
Identify sources of process variation a...
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Submit your application today and join our talented team at Nexperia.
Submit ApplicationJob Details
- Location Seremban, Negeri Sembilan
- Job Type Full-time
- Category Engineers
- Posted Date June 07, 2026
- Application Deadline July 17, 2026