Job Description
A global leader in semiconductor manufacturing is seeking a Plating Process Engineer to enhance semiconductor packaging operations. This role entails leading continuous improvement initiatives focusing on plating process stability and yield improvement, working collaboratively across teams to ensure operational excellence. Ideal candidates will have 5+ years of industry experience, with strong hands-on knowledge of plating processes, proficiency in statistical tools, and a commitment to EHS standards. The position fosters a dynamic and inclusive workplace culture.
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Submit ApplicationJob Details
- Location seremban, negeri sembilan
- Job Type Full-time
- Category Engineering
- Posted Date June 25, 2026
- Application Deadline August 04, 2026