Job Description
Sandisk is seeking a Packaging Engineer to join our R&D group in Batu Kawan, Malaysia. The role focuses on thermal designs for semiconductor packaging and ensuring that products meet packaging demands.
Ideal candidates will have a B.S. in Mechanical Engineering and 5 years of relevant experience. Proficiency in CAD software and a strong work ethic are crucial. Join us to innovate packaging solutions and improve product designs.
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Submit ApplicationJob Details
- Location batu kawan, penang
- Job Type Full-time
- Category Engineering
- Posted Date June 08, 2026
- Application Deadline July 18, 2026