Job Description
Sandisk in Batu Kawan, Penang is seeking a Packaging Engineer to join their R&D group. You'll handle thermal designs across semiconductor packaging, focusing on solutions that meet demands for small form factor packages.
The ideal candidate should possess a B.S. in Mechanical Engineering with at least 5 years of experience and proficiency in CAD software (SolidWorks, AutoCAD). Strong communication skills and a solid work ethic are essential.
#J-18808-LjbffrReady to Apply?
Submit your application today and join our talented team at Sandisk.
Submit ApplicationJob Details
- Location batu kawan, penang
- Job Type Full-time
- Category Engineering
- Posted Date June 19, 2026
- Application Deadline July 29, 2026