Job Description
Nexperia is seeking a technical leader for the Package Development team to lead backend assembly and package platform development. This role involves strategic definition, execution of technology roadmaps, and management of cross-functional collaboration, as well as coaching team members to enhance their technical capabilities.
The ideal candidate will have a Master’s degree in Engineering, a minimum of 10 years of experience in the semiconductor industry, and strong leadership and technical skills related to packaging processes.
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Submit ApplicationJob Details
- Location seremban, negeri sembilan
- Job Type Full-time
- Category Engineering
- Posted Date June 22, 2026
- Application Deadline August 01, 2026