Job Description
Job Description1. Package design and planning of various product.
2. Design & layout of BGA substrate.
3. Co-work with package houses for package design
4. Development of advanced package technology.
5. Package design platform development
#LI-ML2Requirement1. MS or above with major in EE, ME, or related field.
2. Familiar with Cadence APD/SiP and Autocad is a plus
3. Familiar with the design flow of package & BGA substrate is a plus.
4. Familiar with the structures of various packages is a plus: PBGA/TFBGA/FlipChip/POP/PiP/SiP/Module/Fanout.
5. Familiar with Cadence APD skill language is a plus.
6. Familiar with RD layout tool is a plus:
Laker/Virtuoso
2. Design & layout of BGA substrate.
3. Co-work with package houses for package design
4. Development of advanced package technology.
5. Package design platform development
#LI-ML2Requirement1. MS or above with major in EE, ME, or related field.
2. Familiar with Cadence APD/SiP and Autocad is a plus
3. Familiar with the design flow of package & BGA substrate is a plus.
4. Familiar with the structures of various packages is a plus: PBGA/TFBGA/FlipChip/POP/PiP/SiP/Module/Fanout.
5. Familiar with Cadence APD skill language is a plus.
6. Familiar with RD layout tool is a plus:
Laker/Virtuoso
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Submit ApplicationJob Details
- Location Hsinchu City, Taiwan Province
- Job Type Full-time
- Category Engineers
- Posted Date February 28, 2026
- Application Deadline April 09, 2026