Senior Package Architect & R&D Leader

Nexperia
📍 seremban, negeri sembilan, Malaysia 💼 Full-time 🕒 Posted June 07, 2026

Job Description

Nexperia is seeking a highly skilled individual to join their Semiconductor Packaging team in Seremban, Malaysia. The role requires a Master's or PhD degree in a relevant field and entails responsibilities such as leading technical projects, collaborating with a multi-cultural team, and providing technical support. Nexperia emphasizes career growth and offers a permanent contract with competitive pay and benefits. Join a dynamic environment that fosters innovation and personal development.
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Job Details

  • Location seremban, negeri sembilan
  • Job Type Full-time
  • Category Engineering
  • Posted Date June 07, 2026
  • Application Deadline July 17, 2026