Job Description
Description
Machine Learning Israel (MLIL), as part of Annapurna Labs / Amazon, is hiring a Mechanical-Thermal Design Engineer to help define, shape, and integrate the next generation of our ML training and inference accelerators. In this role you will own the mechanical-thermal design of add-in / mezzanine cards, high-power GPU sleds and full ML racks. You will work shoulder-to-shoulder with HW, FW, and silicon teams to drive decisions on cooling solutions, power delivery packaging, structural integrity, and manufacturability, and will lead the mechanical-thermal engagement with our ODM, component vendors and data-center operators.
Key job responsibilities
1. Own the mechanical-thermal design of Annapurna next-generation Machine Learning sled and rack (including thermal solutions and mechanical challenges on PCB / chassis / rack level)
2. Lead and review mechanical and thermal design performed by ODM partners or contractors and component vendors.
3. Debug mechani...
Machine Learning Israel (MLIL), as part of Annapurna Labs / Amazon, is hiring a Mechanical-Thermal Design Engineer to help define, shape, and integrate the next generation of our ML training and inference accelerators. In this role you will own the mechanical-thermal design of add-in / mezzanine cards, high-power GPU sleds and full ML racks. You will work shoulder-to-shoulder with HW, FW, and silicon teams to drive decisions on cooling solutions, power delivery packaging, structural integrity, and manufacturability, and will lead the mechanical-thermal engagement with our ODM, component vendors and data-center operators.
Key job responsibilities
1. Own the mechanical-thermal design of Annapurna next-generation Machine Learning sled and rack (including thermal solutions and mechanical challenges on PCB / chassis / rack level)
2. Lead and review mechanical and thermal design performed by ODM partners or contractors and component vendors.
3. Debug mechani...
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- Location Tel Aviv, Israel
- Job Type Full-time
- Category other-general
- Posted Date June 06, 2026
- Application Deadline June 11, 2026