Senior Manager, Die Bond Product Engineering

ITEC Equipment

📍 Kuala Lumpur, Federal Territory of Kuala Lumpur, Malaysia 💼 Full time 🕒 Posted June 23, 2026

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Job Description

About the role:
If you are passionate about pushing technical boundaries while leading teams to deliver real impact in the field, this is your opportunity to make it happen.
We are looking for a driven Die Bond Product Engineering Manager to lead the next generation of die attach technology, shaping how our equipment performs in real customer applications. In this role, you will own the intersection of machine innovation, process expertise, and customer success, turning complex semiconductor requirements into cutting‑edge, high‑performance solutions.

What You will Be Doing:
Own the process application and performance of the die bonder product portfolio across key packaging segments
Define product requirements, use‑case scenarios, and application benchmarks for new platforms or modules
Lead die attach development, qualification, and NPI ramp to high‑volume manufacturing
Drive yield, reliability, and downtime reductio...
            

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Job Details

Location Kuala Lumpur, Federal Territory of Kuala Lumpur
Job Type Full time
Category Operations Specialties Managers
Posted Date June 23, 2026
Application Deadline August 02, 2026