Senior/ Lead Research Engineer (FAB), Bonding Process Control, IME

A*STAR

📍 Singapore, Singapore, Singapore 💼 Full-Time 🕒 Posted June 18, 2026

Apply Now Similar Jobs

Job Description

Bonding Process Control Engineer ? Role Summary

We are seeking a Bonding Process Control Engineer responsible for owning, optimizing, and sustaining wafer?level bonding processes?including hybrid wafer?to?wafer bonding, chip?to?wafer bonding, and Temporary Bonding & Debonding (TBDB) across multiple wafer sizes and thicknesses.

This role focuses on process stability, SPC governance, yield improvement, defect reduction, and robust process-control strategies for both development and small?volume prototying. The engineer will play a critical role in enabling next?generation heterogeneous integration and advanced packaging technologies.

Key Responsibilities:

Process Control & SPC Ownership
Own and maintain SPC control strategies for bonding processes across multiple toolsets. 

Define Critical Process Parameters (CPPs) and Critical Quality Attributes (CQAs) such as alignment accuracy, bond strength, defectivity, war...

Ready to Apply?

Submit your application today and join our talented team at A*STAR.

Submit Application

Job Details

Location Singapore, Singapore
Job Type Full-Time
Category Engineers
Posted Date June 18, 2026
Application Deadline July 28, 2026