Senior HBM Reliability Engineer & Team Lead

Micron Technology
📍 singapore, singapore, Singapore 💼 Full-time 🕒 Posted June 27, 2026

Job Description

Micron Technology is seeking a leader in High Bandwidth Memory (HBM) Product Engineering to develop a high-performing team focused on reliability test development and execution. This role includes driving extrinsic DPM reduction and optimizing manufacturing test flows to meet critical KPIs.

The ideal candidate will have a degree in Electrical and Electronics Engineering with at least 3 years of experience in the semiconductor industry. Strong leadership, technical skills, and excellent communication abilities are essential. This position is based on site in Singapore with potential international travel.

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Job Details

  • Location singapore, singapore
  • Job Type Full-time
  • Category Other-General
  • Posted Date June 27, 2026
  • Application Deadline August 06, 2026