Senior Failure Analysis Engineer (IC & Package)

Infineon Technologies AG

📍 kulim, kedah, Malaysia 💼 Full-time 🕒 Posted June 07, 2026

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Job Description

Infineon Technologies AG in Kulim, Malaysia is looking for a professional in IC Failure Analysis. The job entails performing functional failure analysis on both wafer and package levels, requiring a strong understanding of electrical verification and problem-solving skills. 
Candidates should have an engineering degree (Bachelor's, Master's, or PhD) and be skilled in advanced failure verification methods. Additional responsibilities include preparing failure analysis reports and achieving efficiency KPIs. 
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Job Details

Location kulim, kedah
Job Type Full-time
Category Engineering
Posted Date June 07, 2026
Application Deadline July 17, 2026