Job Description
About the Role
As a Senior Engineer (Molding), you will be responsible for ensuring the reliability, performance, and continuous improvement of molding equipment in a high-volume semiconductor manufacturing environment. This role plays a critical part in supporting new product introductions, driving yield and uptime improvements, and enabling advanced packaging technologies. You will work closely with cross-functional teams including Process Engineering, R&D, NPI, and Product Design.
What You Will Do
Lead the maintenance, optimization, and continuous improvement of molding equipment across various semiconductor package types.
Monitor equipment downtime (DT) and develop mitigation plans using MTBF/MTBA analysis; evaluate the effectiveness of scheduled downtime activities and ensure proper verification and buy-off.
Partner with Process Engineering during product development and qualification to ensure molding ...
Ready to Apply?
Submit your application today and join our talented team at Nexperia.
Submit ApplicationJob Details
- Location Seremban, Negeri Sembilan
- Job Type Full-time
- Category Engineers
- Posted Date June 05, 2026
- Application Deadline July 15, 2026