Senior Engineer(Wirebond Process Development)

Nexperia
is a world-class company in semiconductor development and in-house production. A proven global player with an entrepreneurial mentality. At our core is an 13,000+ strong international network with a singular focus. Built on passion and commitment to our work, belief in our goals and a drive to succeed regardless of the challenges we face. We support, reward and challenge individuals equally, in a dynamic and energetic environment.

Job Description
About the role
The Senior Engineer (Wirebond Process Development) is responsible for the design, development, optimisation, and industrialisation of wire bonding processes for advanced semiconductor packaging. This role supports New Product Introductions (NPI), technology roadmap projects, and continuous process improvement in high-volume manufacturing (HVM). The engineer ensures process robustness, high yield, and scalability while working with cross-functional teams, including R&D, equipment engineering, quality, ...

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