Job Description
Nexperia in Seremban, Malaysia, is seeking an experienced leader to define and execute technology roadmaps in semiconductor packaging. You will drive the development of packaging solutions and coach a team to overcome technical challenges.
The ideal candidate should have at least 10 years in the semiconductor industry, including managerial experience. A comprehensive understanding of assembly processes and technology is crucial for this role, which promotes a culture of continuous learning and development.
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Submit ApplicationJob Details
- Location seremban, negeri sembilan
- Job Type Full-time
- Category Engineering
- Posted Date June 21, 2026
- Application Deadline July 31, 2026