Job Description
+ Reliability Lab Engineering work for IGBT, HV Si, HV SiC Discrete and Module product.
+ Design of hardware (such as Reliability Boards, Gate Driver IC Boards) for reliability testing and understanding of electronic circuits.
+ To continuously drive Reliability cycle time reduction in meeting customer’s expectation while maintaining the expected standard/quality of Reliability services.
+ Preparation of high-quality reliability reports including Engineering DoE and technical insights.
+ Work closely with Reliability Engineering & Reliability Requestors to ensure their Reliability Requests are running smoothly and flawlessly to meet their committed expectations.
+ To initiate, investigation and respond to Lab induced Qualification failure on a timely basis
+ To maintain an effective quality audit, appraisal and reporting system such that deficiencies are reported back to those responsible for immediate corrective actions and Continuous Improvements.(+IATF16949)
+ A...
+ Design of hardware (such as Reliability Boards, Gate Driver IC Boards) for reliability testing and understanding of electronic circuits.
+ To continuously drive Reliability cycle time reduction in meeting customer’s expectation while maintaining the expected standard/quality of Reliability services.
+ Preparation of high-quality reliability reports including Engineering DoE and technical insights.
+ Work closely with Reliability Engineering & Reliability Requestors to ensure their Reliability Requests are running smoothly and flawlessly to meet their committed expectations.
+ To initiate, investigation and respond to Lab induced Qualification failure on a timely basis
+ To maintain an effective quality audit, appraisal and reporting system such that deficiencies are reported back to those responsible for immediate corrective actions and Continuous Improvements.(+IATF16949)
+ A...
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Submit ApplicationJob Details
- Location Gyeonggi-do, South Korea
- Job Type Full-time
- Category other-general
- Posted Date June 10, 2026
- Application Deadline June 15, 2026