R&D Engineer: Test Engineering Wafer Test, Final Module Test & Characterization

Broadcom Inc.

📍 Regensburg, Bavaria, Germany 💼 Full time 🕒 Posted June 20, 2026

Apply Now Similar Jobs

Job Description

Please Note
 :1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)
2. If you already have a Candidate Account, please Sign-In before you apply.
Job Description:
Development of device testing at wafer level, die level and module level

More specific duties include the following:
Definition of test requirements and test methods for our optoelectronic transceiver and sensor products as well as for our in-house mixed signal ASICs and sensor chips, which are used within these products.
Development, bring up and debugging test hardware and software for evaluation, device characterization (bench) and production testing. This can be either completely in-house or in cooperation with external engineering partners.
Design of test application PCBs, test sockets, probe cards.
Handover of test s...
            

Ready to Apply?

Submit your application today and join our talented team at Broadcom Inc..

Submit Application

Job Details

Location Regensburg, Bavaria
Job Type Full time
Category Engineers
Posted Date June 20, 2026
Application Deadline July 30, 2026