Job Description
Job Description-Lead and manage RFI/RFQ/SOW processes and negotiate commercial terms with AI data center clients, ensuring timely and accurate responses.
- Collaborate closely with engineering, sales, and marketing teams to deliver data center ASIC solutions tailored for AI workloads.
- Develop compelling product positioning and messaging for both internal and external stakeholders.
- Work with field teams to assess competitive landscape and maintain market intelligence.
- Support business development activities to the sales team to foster strong customer relationships.
- Drive cross-functional teams to align on product specifications, timelines, and deliverables.
- Prepare and present detailed product proposals and reports to executive leadership and customers.
- PLM (Product Lifecycle Management), manage program from kickoff, execution, NPI all the way to volume production
#LI-DC3Requirement- Bachelor’s or Master’s degree in Electrical Engin...
- Collaborate closely with engineering, sales, and marketing teams to deliver data center ASIC solutions tailored for AI workloads.
- Develop compelling product positioning and messaging for both internal and external stakeholders.
- Work with field teams to assess competitive landscape and maintain market intelligence.
- Support business development activities to the sales team to foster strong customer relationships.
- Drive cross-functional teams to align on product specifications, timelines, and deliverables.
- Prepare and present detailed product proposals and reports to executive leadership and customers.
- PLM (Product Lifecycle Management), manage program from kickoff, execution, NPI all the way to volume production
#LI-DC3Requirement- Bachelor’s or Master’s degree in Electrical Engin...
Ready to Apply?
Submit your application today and join our talented team at MediaTek.
Submit ApplicationJob Details
- Location Hsinchu City, Taiwan Province
- Job Type Full-time
- Category Advertising, Marketing, Promotions, Public Relations, and Sales Managers
- Posted Date June 29, 2026
- Application Deadline August 08, 2026