Job Description
**Role Number:** 200628412-3401
**Summary**
Join Apple's ATG Sensing Group as a Senior Electronic Packaging Engineer to drive the development of innovative module packaging solutions for new consumer products. In this role, you will own the process development of New Product Introduction, architecting new concepts and defining process flows to ensuring successful high-volume manufacturing with external OSAT partners. You will work at the intersection of design, materials science, and manufacturing, collaborating with internal cross-functional teams and external suppliers to solve complex integration challenges and successfully bring next-generation sensing technologies to market. This position requires a candidate with a proven track record of shipping products, deep technical expertise in assembly processes, and strong leadership skills.
**Description**
Apple’s ATG Sensing Group is looking for a senior level electronic packaging engineer to work on developing ...
**Summary**
Join Apple's ATG Sensing Group as a Senior Electronic Packaging Engineer to drive the development of innovative module packaging solutions for new consumer products. In this role, you will own the process development of New Product Introduction, architecting new concepts and defining process flows to ensuring successful high-volume manufacturing with external OSAT partners. You will work at the intersection of design, materials science, and manufacturing, collaborating with internal cross-functional teams and external suppliers to solve complex integration challenges and successfully bring next-generation sensing technologies to market. This position requires a candidate with a proven track record of shipping products, deep technical expertise in assembly processes, and strong leadership skills.
**Description**
Apple’s ATG Sensing Group is looking for a senior level electronic packaging engineer to work on developing ...
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Submit ApplicationJob Details
- Location San Francisco, CA
- Job Type Full-time
- Category other-general
- Posted Date June 27, 2026
- Application Deadline July 06, 2026