Process Development Engineer (Wire bond Package R&D)

Nexperia
📍 Seremban, Negeri Sembilan, Malaysia 💼 Full time 🕒 Posted June 06, 2026

Job Description

As a Process Development Engineer (WB), you will develop and optimize semiconductor assembly processes to meet project Functional Requirement Specifications (FRS), ensuring robust manufacturability, reliability, and high-quality output for new products and platforms.

What You Will Do

  • Develop and characterize new semiconductor process technologies, applying structured engineering methods such as DOE, SPC, FMEA, and Six Sigma

  • Drive end-to-end process development from concept to stable, high-yield manufacturing solutions

  • Provide technical input for assembly processes and equipment solutions for new products and platforms

  • Lead technical discussions and troubleshooting on wire bond and related FOL processes across project teams and sites

  • Apply wafer metallization knowledge to optimize process performance and stability

  • Conduct benchmarking and technology studies to support package roadmap and...

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    Job Details

    • Location Seremban, Negeri Sembilan
    • Job Type Full time
    • Category Engineers
    • Posted Date June 06, 2026
    • Application Deadline July 16, 2026