Job Description
We are looking for a Principal Package Design Engineer to support new semiconductor package development and continuous design improvement, primarily focusing on discrete packages. This role plays a key part in New Product Introduction (NPI) as well as mass production, ensuring robust, manufacturable, and cost-effective package designs. You will collaborate closely with package architects and cross-functional engineering teams to deliver high-quality assembly designs aligned with industry and internal standards.
What You Will Do
Lead and support lead frame package design for NPI and mass production phases, ensuring alignment with functional and manufacturing requirements
Work closely with Package Architects to develop technical assembly drawings
Define and finalize dimensions and tolerances based on assembly capability, package technology, and lead frame fabrication design rules
Ensure compliance with industry standa...
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Submit ApplicationJob Details
- Location Seremban, Negeri Sembilan
- Job Type Full time
- Category Engineers
- Posted Date June 07, 2026
- Application Deadline July 17, 2026