Job Description
About the Company
Cadence Bangalore is Hiring
About the Role
We are seeking an experienced IC Package Design Engineer with strong expertise in flip‑chip package design and IC‑Package‑PCB co‑design, focusing on signal integrity (SI), power integrity (PI), and thermal optimization. The role requires close collaboration with cross‑functional teams and customers to deliver optimized, cost‑effective, and high‑performance package solutions.
Responsibilities
Lead flip‑chip package design with a strong focus on SI/PI and thermal constraints.
Drive IC–Package–PCB co‑design, balancing performance, power, cost, technology, and thermal trade‑offs.
Collaborate closely with cross‑functional teams and customers to define and deliver optimal end‑to‑end solutions.
Support die floorplanning, IO placement and perform bump definition, routing feasibility analysis, and optimization of Package stack‑up, BGA ball map and PCB design interfaces.
Execute 2D/3D EM simulations and apply...
Cadence Bangalore is Hiring
About the Role
We are seeking an experienced IC Package Design Engineer with strong expertise in flip‑chip package design and IC‑Package‑PCB co‑design, focusing on signal integrity (SI), power integrity (PI), and thermal optimization. The role requires close collaboration with cross‑functional teams and customers to deliver optimized, cost‑effective, and high‑performance package solutions.
Responsibilities
Lead flip‑chip package design with a strong focus on SI/PI and thermal constraints.
Drive IC–Package–PCB co‑design, balancing performance, power, cost, technology, and thermal trade‑offs.
Collaborate closely with cross‑functional teams and customers to define and deliver optimal end‑to‑end solutions.
Support die floorplanning, IO placement and perform bump definition, routing feasibility analysis, and optimization of Package stack‑up, BGA ball map and PCB design interfaces.
Execute 2D/3D EM simulations and apply...
Ready to Apply?
Submit your application today and join our talented team at Cadence.
Submit ApplicationJob Details
- Location Bengaluru, Karnataka
- Job Type Full-time
- Category Engineers
- Posted Date February 24, 2026
- Application Deadline April 05, 2026