Packaging Module Equipment Development Engineer

Intel
📍 Phoenix, AZ, United States 💼 Full-time 🕒 Posted June 06, 2026

Job Description

**Job Details:**

**Job Description:**

Note: This role requires regular onsite presence to fulfill essential job responsibilities.

Develops assembly processes and/or equipment and applies innovative engineering concepts to support Intel’s future assembly packaging platform technologies. Optimizes manufacturing processes to improve quality, reliability, cost, yield, productivity, and manufacturability.

Develops process and equipment specifications using Design of Experiments (DOE), Statistical Process Control (SPC), and data analysis methodologies to drive process optimization and continuous improvement. Documents technical findings, process improvements, and best practices through technical reports and white papers.

Develops and maintains equipment used to evaluate silicon and package technologies under simulated field-use conditions, including heat, humidity, temperature cycling, and dynamic force environments. Ensures manufacturability of p...

Ready to Apply?

Submit your application today and join our talented team at Intel.

Submit Application

Job Details

  • Location Phoenix, AZ
  • Job Type Full-time
  • Category other-general
  • Posted Date June 06, 2026
  • Application Deadline June 11, 2026