Packaging Module Development Engineer

About the Role

Join Intel's Advanced Packaging Technology and Manufacturing team and help shape the future of semiconductor packaging. In this role, you will develop and optimize cutting-edge equipment and processes that enable next-generation packaging solutions.

Your work will directly impact product performance, manufacturability, and reliability at scale supporting innovations that power computing advancements globally.

What You'll Do

Key responsibilities will include but not limited to :

• Develop, qualify, and optimize semiconductor packaging equipment and processes to meet quality, yield, cost, and reliability targets
• Apply statistical methods (DOE, SPC) to analyze process performance and drive continuous improvement
• Design and execute experiments to validate packaging technologies under environmental stress conditions (e.g., thermal cycling, humidity...

Ready to Apply?

Submit your application today and join our talented team at INTEL.