Job Description
The Emerging Packaging and Test Team at Texas Instruments is looking for a Magnetics and Passives Integration Technologist
+ Lead the definition, development and realization of comprehensive low-profile inductors, planar magnetics, and integrated passives roadmaps to enable ultra-compact, high-density, high current (100-300A) power delivery modules for enterprise and AI infrastructure
+ Develop strategic relationships and partnerships with leading suppliers worldwide to co-develop magnetic materials, inductors, capacitors, and packaging technologies that meet performance, reliability, and scaling needs.
+ Ensure manufacturability, testability and reliability through early-stage DfX, material qualification, and close supplier collaboration.
The candidate must be a proven leader, capable of working collaboratively across worldwide cross functional teams and accelerating development cycles to meet aggressive time-to market targets.
+ Lead the definition, development and realization of comprehensive low-profile inductors, planar magnetics, and integrated passives roadmaps to enable ultra-compact, high-density, high current (100-300A) power delivery modules for enterprise and AI infrastructure
+ Develop strategic relationships and partnerships with leading suppliers worldwide to co-develop magnetic materials, inductors, capacitors, and packaging technologies that meet performance, reliability, and scaling needs.
+ Ensure manufacturability, testability and reliability through early-stage DfX, material qualification, and close supplier collaboration.
The candidate must be a proven leader, capable of working collaboratively across worldwide cross functional teams and accelerating development cycles to meet aggressive time-to market targets.
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Submit your application today and join our talented team at Texas Instruments.
Submit ApplicationJob Details
- Location Taiwan, Taiwan
- Job Type Full-time
- Category other-general
- Posted Date March 02, 2026
- Application Deadline April 04, 2026