Package Architect – Advanced Packaging & System Exploration
Micron Technology, Inc.
Job Description
**Our vision is to transform how the world uses information to enrich life for** **_all_** **.**
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
We explore what’s next before constraints take over. Our architecture team defines package concepts that enable future memory and system products, influencing roadmaps long before execution begins.
This is a hands‑on architecture role focused on early‑phase package exploration. You will independently build, model, and simulate advanced package concepts and turn results into clear architectural direction.
Responsibilities:
Define and explore advanced package architectures for future memory systems
Perform package‑level trade‑off studies across SI, PI, thermals, cost, and scalability
Create hands‑on package designs and mode...
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
We explore what’s next before constraints take over. Our architecture team defines package concepts that enable future memory and system products, influencing roadmaps long before execution begins.
This is a hands‑on architecture role focused on early‑phase package exploration. You will independently build, model, and simulate advanced package concepts and turn results into clear architectural direction.
Responsibilities:
Define and explore advanced package architectures for future memory systems
Perform package‑level trade‑off studies across SI, PI, thermals, cost, and scalability
Create hands‑on package designs and mode...
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Submit ApplicationJob Details
- Location San Jose, CA
- Job Type Full-time
- Category other-general
- Posted Date June 20, 2026
- Application Deadline June 25, 2026