Job Description
To contribute in advancing high‑precision semiconductor production by applying technical skills in back‑end assembly test operation.
• Perform specific back-end semiconductor manufacturing functions in the production of semiconductor devices
• Operate various equipment in performing functions such as wafer scribe and break, die sort, die attach, lead bonding and seal, test, or mark and pack.
Graduate of a 2-year Technical course or Senior High School, or completed at least 2 years in college
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Submit ApplicationJob Details
- Location Carmona, Calabarzon
- Job Type Full-time
- Category Other Production Occupations
- Posted Date March 02, 2026
- Application Deadline April 11, 2026