New College Grad - Wafer Bonding Process Development Engineer

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a Wafer Bonding Process Development Engineer, you will be part of a groundbreaking advanced memory technology development team. The position promises ample opportunity for innovation, collaboration and testing new dimensions in Advanced DRAM. You will work directly with Process Integration and other process areas including Dry Etch, Wet process, Metals, CVD, Diffusion, Lithography and CMP. You will work on state-of-the-art equipment and own the process roadmap to meet the program and yield goals.

Job Responsibilities:

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Submit your application today and join our talented team at Micron.