Memory Packaging Technical Manager

MediaTek

📍 Hsinchu City, Taiwan Province, Taiwan 💼 Full-time 🕒 Posted March 02, 2026

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Job Description

                Job DescriptionProduct 2.5D/3D/3.5D heterogeneous package development, LPDDR/HBM/IPM development for advanced package, product memory roadmap, package memory architecture , customized HBM developmentRequirement1. >10yrs DRAM (LPDDR/HBM..) technical experience, RD is a plus. 2. Familiar with memory design, architecture, process, packaging, materials… 3. Project handling experience
            

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Job Details

Location Hsinchu City, Taiwan Province
Job Type Full-time
Category Operations Specialties Managers
Posted Date March 02, 2026
Application Deadline April 11, 2026