ME-内外层工艺工程师

TTM Technologies, Inc. – Publicly Traded US Company, NASDAQ (TTMI) – Top-5 Global Printed Circuit Board Manufacturer

About TTM

TTM Technologies, Inc. is a leading global manufacturer of technology products, including mission systems, radio frequency (“RF”) components, RF microwave/microelectronic assemblies, and technologically advanced printed circuit boards (“PCB”s). TTM stands for time-to-market, representing how TTM's time-critical, one-stop design, engineering and manufacturing services enable customers to reduce the time required to develop new products and bring them to market.

1.解决工序出现的异常品质问题及品质改善。
2.为产线提供及时的技术支持，快速分析和解决干菲林&蚀刻过程异常问题。
3.主导或参与干菲林&蚀刻相关的质量事故分析，并有效的纠正与预防措施。
4.参与引进、测试及验收新设备/新物料。
5.参与新流程工艺能力提升研究。
6.内层药水及SPC控制。
7.负责内层阻抗维稳及超差分析优化。

Applicants may be entitled to: 

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